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How do you judge whether the solder dip method is appropriate or not?

Latest Updated:11/01/2007

Question:

How do you judge whether the solder dip method is appropriate or not?

Answer:

The method of immersing a whole board in a solder vat is not recommended. Neither is wave soldering recommended for packages such as SOJ and BGA of which solder penetration is problematic, and for surface-mount packages with a lead pitch of less than 0.65 mm, where solder bridges can be made.
Neither is the solder dip method recommended for lead-free products that include metals other than solder, such as bismuth, used to plate the pins.
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